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3dic.org menu home project:help about navigation categories all pages random page wanted pages contribution scores comments search what links here related changes special pages printable version permanent link page information browse properties recent changes project:help log in 3dic.org may not look as expected in this version of internet explorer. we recommend you upgrade to a newer version of internet explorer or switch to a browser like firefox or chrome. cutting-edge 3d ic integration and packaging technologies www.3dic.org/home more news ... date "date" is a type and predefined property provided by semantic mediawiki to represent date values. leti demonstrates world's first 300-mm wafer-to-wafer direct hybrid bonding with 1-micron pitch 13 november 2017 smic signs license agreement for invensas' dbi technology 15 march 2017 imec and evg demonstrate 1.8µm pitch overlay accuracy for wafer-to-wafer hybrid bonding 23 january 2017 qualcomm announces 10nm finfet centriq 2400 server processor with 48 cores 7 december 2016 more events ... location date "date" is a type and predefined property provided by semantic mediawiki to represent date values. eptc 2017 singapore 6 december 2017 ectc 2017 florida, usa 30 may 2017 2017 5th international workshop on low temperature bonding for 3d integration (ltb-3d 2017) tokyo, japan 16 may 2017 ieee international electron devices meeting (iedm) 2016 san francisco, usa 3 december 2016 ▼ 3d schemes 2.5d integration 3d integration 3d packaging parallel 3d integration sequential 3d integration single-grain thin-film transistors ▼ 2.5d integration cowos embedded interposer carrier emib glass interposer si interposer tgv ▼ parallel 3d integration ► bump-based parallel 3d integration ► bump-less parallel 3d integration diram mochi supercontacts tgv tov tsv wafer bonding wow ▼ sequential 3d integration coolcube laser crystallization layer transfer wafer bonding ▼ 3d design 3d noc bandwidth cacti-3dd freepdk3d45 pathfinder3d serdes tsv keep-out zone ▼ 3d standards hbm wide io ▼ silicon photonics mems-electronic-photonic heterogeneous integration semiconductor-on-insulator soi ▼ display microled ▼ 3d applications 3d fpga 3d memory 3d mmic 3d stacked image sensor memory-on-processor mems-on-cmos ▼ 3d memory ► 3d dram 3d dram 3d nand 3d rram 3d sram 3d ssd 3d xpoint diram hbm hmc reram wide io ▼ memory-on-processor 3d-maps centip3de liquid silicon ▼ 3d interconnects capacitive coupling hybrid bonding inductive coupling microbump supercontacts tgv tmv tov tsv vias ▼ semiconductor devices cis nand transistor ▼ heterogeneous integration mems-electronic-photonic heterogeneous integration mems-on-cmos parallel 3d integration semiconductor-on-insulator wafer bonding ▼ advanced packaging 3d packaging cone bumps electro-optical integration embedded si fan-out (esifo) embedded wafer level bga (ewlb) flip-chip foclp fowlp info microbump pop power sip sip slim soc swift wafer-level underfill waveguide wlcsp ▼ semiconductor companies altera amd amkor fujitsu globalfoundries ibm infineon intel qualcomm samsung sk hynix stats chippac stmicroelectronics tessera technologies tezzaron toshiba tsmc xilinx ▼ bonding schemes c2c bonding c2w bonding f2b bonding f2f bonding multichip-to-wafer bonding w2w bonding ▼ bonding methods ag sintering bump-based bonding bump-less bonding cone bumps dbi direct bonding eutectic bonding hybrid bonding polymer adhesive bonding surface activated bonding (sab) thermal compression bonding ultrasonic bonding zibond ▼ semiconductor processes ► thin film deposition ald cmp raised source/drain ▼ materials ► 2d materials ► semiconductor-on-insulator ald al2o3 high-k dielectric high-mobility semiconductors low-k dielectric semiconductor-on-insulator wide-bandgap semiconductors ▼ wide-bandgap semiconductors gan retrieved from " http://www.3dic.org/index.php?title=home&oldid=1485 " about 3dic.org

URL analysis for 3dic.org

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Whois Information

Whois is a protocol that is access to registering information. You can reach when the website was registered, when it will be expire, what is contact details of the site with the following informations. In a nutshell, it includes these informations;

Domain Name: 3DIC.ORG
Registry Domain ID: D402200000000217305-LROR
Registrar WHOIS Server:
Registrar URL: http://www.name.com
Updated Date: 2017-09-14T17:11:56Z
Creation Date: 2016-10-06T06:26:13Z
Registry Expiry Date: 2018-10-06T06:26:13Z
Registrar Registration Expiration Date:
Registrar: Name.com, LLC
Registrar IANA ID: 625
Registrar Abuse Contact Email: [email protected]
Registrar Abuse Contact Phone: +1.7203101849
Reseller:
Domain Status: clientTransferProhibited https://icann.org/epp#clientTransferProhibited
Registry Registrant ID: C156892042-LROR
Registrant Name: Ran He
Registrant Organization: 3DIC
Registrant Street: Tokyo, Japan
Registrant City: Tokyo
Registrant State/Province: Non-US/Canada
Registrant Postal Code: 110-0008
Registrant Country: JP
Registrant Phone: +81.8094101219
Registrant Phone Ext:
Registrant Fax:
Registrant Fax Ext:
Registrant Email: [email protected]
Registry Admin ID: C156892042-LROR
Admin Name: Ran He
Admin Organization: 3DIC
Admin Street: Tokyo, Japan
Admin City: Tokyo
Admin State/Province: Non-US/Canada
Admin Postal Code: 110-0008
Admin Country: JP
Admin Phone: +81.8094101219
Admin Phone Ext:
Admin Fax:
Admin Fax Ext:
Admin Email: [email protected]
Registry Tech ID: C156892042-LROR
Tech Name: Ran He
Tech Organization: 3DIC
Tech Street: Tokyo, Japan
Tech City: Tokyo
Tech State/Province: Non-US/Canada
Tech Postal Code: 110-0008
Tech Country: JP
Tech Phone: +81.8094101219
Tech Phone Ext:
Tech Fax:
Tech Fax Ext:
Tech Email: [email protected]
Name Server: NS1KPV.NAME.COM
Name Server: NS3CQZ.NAME.COM
Name Server: NS2FWZ.NAME.COM
Name Server: NS4SXY.NAME.COM
DNSSEC: unsigned
URL of the ICANN Whois Inaccuracy Complaint Form: https://www.icann.org/wicf/
>>> Last update of WHOIS database: 2018-03-31T10:24:58Z <<<

For more information on Whois status codes, please visit https://icann.org/epp

Access to Public Interest Registry WHOIS information is provided to assist persons in determining the contents of a domain name registration record in the Public Interest Registry registry database. The data in this record is provided by Public Interest Registry for informational purposes only, and Public Interest Registry does not guarantee its accuracy. This service is intended only for query-based access. You agree that you will use this data only for lawful purposes and that, under no circumstances will you use this data to: (a) allow, enable, or otherwise support the transmission by e-mail, telephone, or facsimile of mass unsolicited, commercial advertising or solicitations to entities other than the data recipient's own existing customers; or (b) enable high volume, automated, electronic processes that send queries or data to the systems of Registry Operator, a Registrar, or Afilias except as reasonably necessary to register domain names or modify existing registrations. All rights reserved. Public Interest Registry reserves the right to modify these terms at any time. By submitting this query, you agree to abide by this policy.

  REFERRER http://www.pir.org/

  REGISTRAR Public Interest Registry

SERVERS

  SERVER org.whois-servers.net

  ARGS 3dic.org

  PORT 43

  TYPE domain

DOMAIN

  NAME 3dic.org

  HANDLE D402200000000217305-LROR

  CREATED 2016-06-10

STATUS
clientTransferProhibited https://icann.org/epp#clientTransferProhibited

NSERVER

  NS1KPV.NAME.COM 162.88.61.47

  NS3CQZ.NAME.COM 162.88.61.49

  NS2FWZ.NAME.COM 162.88.60.47

  NS4SXY.NAME.COM 162.88.60.49

OWNER

  HANDLE C156892042-LROR

  NAME Ran He

  ORGANIZATION 3DIC

ADDRESS

STREET
Tokyo, Japan

  CITY Tokyo

  STATE Non-US/Canada

  PCODE 110-0008

  COUNTRY JP

  PHONE +81.8094101219

  EMAIL [email protected]

ADMIN

  HANDLE C156892042-LROR

  NAME Ran He

  ORGANIZATION 3DIC

ADDRESS

STREET
Tokyo, Japan

  CITY Tokyo

  STATE Non-US/Canada

  PCODE 110-0008

  COUNTRY JP

  PHONE +81.8094101219

  EMAIL [email protected]

TECH

  HANDLE C156892042-LROR

  NAME Ran He

  ORGANIZATION 3DIC

ADDRESS

STREET
Tokyo, Japan

  CITY Tokyo

  STATE Non-US/Canada

  PCODE 110-0008

  COUNTRY JP

  PHONE +81.8094101219

  EMAIL [email protected]

  REGISTERED yes

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